info@hpcelectrosales.com
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SOLDERING

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SOLDERING


We Provide SMT & Through hole assembly. In Through hole mounting finds usage in DIP aka dual inline packaging , pin grid array package.Also in Surface mounting the technology used in flatpack packages & Chip carrier packages.

Service Features

  • Through hole Soldering
  • SMT Soldering.
  • Reflow Soldering
  • Unreliable Solder Joints

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